Capacitor component

ABSTRACT

A capacitor component includes a body including a plurality of dielectric layers having a stacked structure and a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with dielectric layers disposed therebetween. A first external electrode is on a first surface and a second surface of the body, on the opposing side of the body, and connected to the plurality of first internal electrodes. A second external electrode is on a third surface and a fourth surface of the body, opposing each other, and connected to one or more of the plurality of second internal electrodes.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation patent application of U.S. patentapplication Ser. No. 15/407,826, filed on Jan. 17, 2017 claims thebenefit of priority to Korean Patent Application No. 10-2016-0076856,filed on Jun. 20, 2016 with the Korean Intellectual Property Office, theentireties of each of which is incorporated herein by reference.

BACKGROUND 1. Field

The present disclosure relates to a capacitor component.

2. Description of Related Art

A multilayer ceramic capacitor (MLCC), a capacitor component, is acondenser in the form of a chip serving to charge or dischargeelectricity while mounted on a printed circuit board of a Liquid CrystalDisplay (LCD) , a Plasma Display Panel (PDP), or the like, of variouselectronic products such as video cameras, computers, smartphones,mobile phones, and the like.

An MLCC may be used as a component of various electronic devices sincean MLCC is small, ensures high capacity, and is easily mounted.

A power supply device for a central processing unit (CPU) of a computeror the like may have a problem where voltage noise occurs due to a rapidchange in a load current while a low voltage is provided. MLCCs havebeen widely used in power supply devices for the use of a decouplingcapacitor for suppressing voltage noise. When using an MLCC fordecoupling or the like, attempts have been made to reduce impedance in awide band.

SUMMARY

An aspect of the present disclosure provides a capacitor componenthaving a plurality of resonance frequencies to effectively controlimpedance in a wide frequency band. Another aspect of the presentdisclosure provides a component having a reduced size by including thecapacitor component described above.

According to an aspect of the present disclosure, a novel capacitorcomponent includes a body including a plurality of dielectric layershaving a stacked structure and a plurality of first and second internalelectrodes alternately disposed with the dielectric layers disposedtherebetween. A first external electrode is on a first surface and asecond surface of the body, on the opposing side of the body, andconnected to the plurality of first internal electrodes. A secondexternal electrode is on a third surface and a fourth surface of thebody, opposing each other, and connected to the plurality of secondinternal electrodes. The capacitor component may be divided into aplurality of capacitor units, each of which include a portion of theplurality of first internal electrodes and a portion of the plurality ofsecond internal electrodes. The plurality of capacitor units include afirst capacitor unit and a second capacitor unit. The first capacitorunit has a structure of a through-type capacitor in which the firstinternal electrodes are connected to the first external electrode by alead out portion exposed to the first surface and the second surface.

At least a portion of the plurality of capacitor units may generatedifferent resonance frequencies from those of a remaining portionthereof.

The first internal electrodes included in the second capacitor unit maybe connected to the first external electrode by a lead out portionexposed to at least one of the first surface and the second surface.

A lead out portion of the first internal electrodes in the firstcapacitor unit may have a width greater than that of a lead out portionof the first internal electrode included in the second capacitor unit.

A lead out portion of the first internal electrodes in the secondcapacitor unit may be disposed in a position to one side of a centerline of the first internal electrode.

A lead out portion of the second internal electrodes in the secondcapacitor unit may be disposed in a position to one side of a centerline of the second internal electrode.

A lead out portion of the second internal electrodes in the secondcapacitor unit may be disposed in a position to one side of a centerline of the second internal electrode in a direction away from the leadout portions of the first internal electrode in the second capacitorunit.

The second internal electrodes in the first capacitor unit maybeconnected to the second external electrode through a lead out portionexposed to the third surface and the fourth surface.

The second internal electrodes in the second capacitor unit maybeconnected to the second external electrode through a lead out portionexposed to at least one of the third surface and the fourth surface.

A lead out portion of the second internal electrodes in the firstcapacitor unit may have a width greater than that of a lead out portionof the second internal electrodes in the second capacitor unit.

The second capacitor unit may be above the first capacitor unit.

In the body, a marking unit indicating a mounting direction of thecapacitor component may be formed therein.

The marking unit may be formed of ceramic, a different material fromthat of a different region of the body.

According to an aspect of the present disclosure, a mounting structureof a capacitor component includes a capacitor component that includes abody including a plurality of dielectric layers having a stackedstructure and a plurality of first and second internal electrodesalternately disposed with the dielectric layers disposed therebetween. Afirst external electrode is on a first surface and a second surface ofthe body, on the opposing side of the body, and connected to theplurality of first internal electrodes. A second external electrode ison a third surface and a fourth surface of the body, opposing eachother, and connected to the plurality of second internal electrodes. Thecapacitor component is divided into a plurality of capacitor units, eachof which includes a portion of the plurality of first internalelectrodes and a portion of the plurality of second internal electrodes.The plurality of capacitor units include a first capacitor unit and asecond capacitor unit. The mounting structure of a capacitor componentincludes a mounting substrate on which the capacitor component isdisposed. The first capacitor unit is a through-type capacitor in whichthe first internal electrodes are connected to the first externalelectrode by a lead out portion exposed to the first surface and thesecond surface.

In the capacitor component, the first capacitor unit may be disposed tooppose the mounting substrate.

The mounting substrate may include three circuit patterns connected tothe first external electrode and the second external electrode.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view schematically illustrating a capacitorcomponent according to an exemplary embodiment;

FIG. 2 is a perspective view schematically illustrating a form of a bodyin the capacitor component of FIG. 1;

FIG. 3 is a plan view schematically illustrating a form of a firstinternal electrode and a second internal electrode included in a firstcapacitor unit in the capacitor component of FIG. 1;

FIG. 4 is a plan view schematically illustrating a form of a firstinternal electrode and a second internal electrode included in a secondcapacitor unit in the capacitor component of FIG. 1;

FIG. 5 illustrates a form in which a capacitor component according to anexemplary embodiment is mounted on a substrate;

FIG. 6 is a graph illustrating impedance characteristics of a capacitorcomponent obtained according to an exemplary embodiment;

FIG. 7 is a perspective view schematically illustrating a capacitorcomponent of a modified example;

FIG. 8 is a plan view schematically illustrating a form of a firstinternal electrode included in a second capacitor unit in a capacitorcomponent according to a modified example; and

FIG. 9 is a plan view schematically illustrating a form of a secondinternal electrode included in a second capacitor unit in a capacitorcomponent according to a modified example.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described asfollows with reference to the attached drawings.

The present disclosure may, however, be exemplified in many differentforms and should not be construed as being limited to the specificembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the disclosure to those skilled in the art.

Throughout the specification, it will be understood that when anelement, such as a layer, region or wafer (substrate) , is referred toas being “on,” “above,” “connected to,” or “coupled to” another element,it can be directly “on,” “connected to,” or “coupled to” the otherelement or other elements intervening therebetween may be present. Incontrast, when an element is referred to as being “directly on,”“directly connected to,” or “directly coupled to” another element, theremay be no other elements or layers intervening therebetween. Likenumerals refer to like elements throughout.

It will be apparent that though the terms first, second, third, etc. maybe used herein to describe various members, components, regions, layersand/or sections, these members, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one member, component, region, layer or section fromanother region, layer or section. Thus, a first member, component,region, layer or section discussed below could be termed a secondmember, component, region, layer or section without departing from theteachings of the exemplary embodiments.

Spatially relative terms, such as “above,” “upper,” “below,” and “lower”and the like, maybe used herein for ease of description to describe oneelement's relationship relative to another element(s) as shown in thefigures. It will be understood that the spatially relative terms areintended to encompass different orientations of the device in use oroperation in addition to the orientation depicted in the figures. Forexample, if the device in the figures is turned over, elements describedas “above,” or “upper” relative to other elements would then be oriented“below,” or “lower” relative to the other elements or features. Thus,the term “above” can encompass both the above and below orientationsdepending on a particular direction of the figures. The device may beotherwise oriented (rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein may be interpretedaccordingly.

The terminology used herein describes particular embodiments only, andthe present disclosure is not limited thereby.

Hereinafter, embodiments of the present disclosure will be describedwith reference to schematic views illustrating embodiments of thepresent disclosure. In the drawings, for example, due to manufacturingtechniques and/or tolerances, modifications of the shape shown may beestimated. Thus, embodiments of the present disclosure should not beconstrued as being limited to the particular shapes of regions shownherein, for example, to include a change in shape results inmanufacturing. The following embodiments may also be constituted by oneor a combination thereof.

The contents of the present disclosure described below may have avariety of configurations and propose only a required configurationherein, but are not limited thereto.

FIG. 1 is a perspective view schematically illustrating a capacitorcomponent according to an exemplary embodiment. FIG. 2 is a perspectiveview schematically illustrating a form of a body in the capacitorcomponent of FIG. 1. FIG. 3 is a plan view schematically illustrating aform of a first internal electrode and a second internal electrodeincluded in a first capacitor unit in the capacitor component of FIG. 1.FIG. 4 is a plan view schematically illustrating a form of a firstinternal electrode and a second internal electrode included in a secondcapacitor unit in the capacitor component of FIG. 1.

With reference to FIGS. 1 to 4, the capacitor component 100 according toan exemplary embodiment may include a body 101, first internalelectrodes 121 and 123, second internal electrodes 122 and 124, firstexternal electrodes 141 and 142, and second external electrodes 151 and152. The capacitor component may be divided into a plurality ofcapacitor units C1 and C2, and each of the plurality of capacitor unitsC1 and C2 includes a portion of a plurality of first and second internalelectrodes 121 to 124. The first capacitor unit C1 may form athrough-type capacitor in which first internal electrodes 121 areconnected to the first external electrodes 141 and 142 through lead outportions R1 and R2. The plurality of capacitor units include the firstcapacitor unit C1 and second capacitor unit C2, but may include one ormore additional capacitor units.

The first external electrodes 141 and 142 may respectively be formed onat least the first surface S1 and the second surface S2 of the body 101opposing each other, to be connected to the first internal electrodes121 and 123. The first external electrode 141 is on the first surfaceS1, and the first external electrode 142 is on the second surface S2.The first surface S1 and the third surface S3 may be perpendicular toeach other, whereby the body 101 may have a rectangular parallelepipedor a shape similar thereto.

The second external electrodes 151 and 152 may respective be formed onat least one of the third surface S3 and the fourth surface S4 of thebody 101, which surfaces connect the first surface S1 to the secondsurface S2 and oppose each other, and connected to the second internalelectrodes 122 and 124. The second external electrodes 151 and 152 mayhave a 4-terminal structure formed on all of the third surface S3 andthe fourth surface S4. As will be described later, the capacitorcomponent 100 may be disposed to allow the first capacitor unit C1 tooppose a mounting substrate. The first surface S1 and the fourth surfaceS4 may be perpendicular to the mounting substrate.

The body 101 may include a plurality of dielectric layers 110 having astacked structure, and first internal electrodes and second internalelectrodes 121 to 124 alternately disposed with dielectric layers 110disposed therebetween. The dielectric layers 110 included in the body101 may be formed of a dielectric material known in the art such asceramic or the like, for example, BaTiO₃ (barium titanate) -basedceramic powder or the like. In this case, BaTiO₃-based ceramic powdermay be, for example, (Ba_(1-x)Ca_(x)) TiO₃, Ba (Ti_(1-y)Ca_(y))O₃,(Ba_(1-x)Ca_(x)) (Ti_(1-y)Zr_(y))O₃ or Ba (Ti_(1-y)Zr_(y))O₃, in whichcalcium (Ca) , zirconium (Zr) or the like is added to BaTiO₃, but arenot limited thereto.

As described above, the first capacitor unit C1 and the second capacitorunit C2 can have different resonance frequencies to improve noiseremoval when the capacitor component 100 is applied as a filter or thelike. In this case, the first capacitor unit C1 is provided as a3-terminal type and through-type capacitor, and the second capacitorunit C2 is provided as a 2-terminal type capacitor. The second capacitorunit C2 may have relatively high direct current equivalent inductance(ESL). An external terminal configuration such as a 3-terminalstructure, a 2-terminal or the like, exemplified in an exemplaryembodiment, may be modified in a range to maintain the technical idea ofthe exemplary embodiment. Hereinafter, specific configurations withrespect to the first capacitor unit C1 and the second capacitor unit C2will be described.

With reference to FIGS. 2 to 4, the first capacitor unit C1 is athrough-type capacitor in which the first internal electrodes 121 areconnected to the first external electrodes 141 and 142 through the leadout portions R1 and R2 respectively exposed to the first surface S1 andthe second surface S2. The second internal electrodes 122 in the firstcapacitor unit C1 may be connected to the second external electrodes 151and 152 through lead out portions R3 and R4 respectively exposed to thethird surface S3 and the fourth surface S4.

A width W1 of the lead out portions R1 and R2 of the first internalelectrodes 121 included in the first capacitor unit C1 can be greaterthan a width W3 of a lead out portion R5 of the first internalelectrodes 123 included in the second capacitor unit C2. In the firstcapacitor unit C1 and the second capacitor unit C2, widths of lead outportions of the first internal electrodes 121 and 123 can be differentfrom each other to allow lead out portions R5 and R6 of the firstinternal electrode 123 and the second internal electrode 124 in thesecond capacitor unit C2 to be relatively spaced away from each other soas to increase ESL. Thus, resonance frequencies may be generated in alow frequency side by the second capacitor unit C2. A width of the firstinternal electrodes 121 included in the first capacitor unit C1 can bethe same as a width W1 of the lead out portions R1 and R2, but the widthW1 of the lead out portions R1 and R2 may be less than a width of thefirst internal electrodes 121.

As illustrated in FIG. 4, the first internal electrode 123 included inthe second capacitor unit C2 may be connected to the first externalelectrodes 142 through the lead out portion R5 exposed to at least oneof the first surface S1 and the second surface S2. The first internalelectrode may have a form in which the lead out portion R5 is only ledout to the second surface S2. The second internal electrodes 124included in the second capacitor unit C2 may be connected to the secondexternal electrodes 151 and 152 through the lead out portion R6 exposedto at least one of the third surface S3 and the fourth surface S4. Thesecond internal electrodes may have a form in which the lead out portionR6 is only formed in the fourth surface S4.

The lead out portion R5 of the first internal electrodes 123 in thesecond capacitor unit C2 may be disposed in a position to one side of acenter line CL of the first internal electrodes 123 in one direction(based on FIG. 4). The lead out portion R6 of the second internalelectrodes 124 in the second capacitor unit C2 may be disposed in aposition to one side of the center line CL of the second internalelectrodes 124, and may be disposed in a position to a side of thecenter line CL of the first internal electrodes 123 in a direction awayfrom the lead out portion R5. With a structure as described above, thelead out portions R5 and R6 are spaced apart from each other torelatively increase ESL of the second capacitor unit C2. Thus, thesecond capacitor unit C2 may allow resonance frequencies on a lowfrequency side to be generated.

As illustrated in FIGS. 3 and 4, a width W2 of the lead out portions R3and RA of the second internal electrodes 122 in the first capacitor unitC1 can be greater than a width W4 of the lead out portion R6 of thesecond internal electrodes 124 in the second capacitor unit C2. With astructure as described above, ESL of the second capacitor unit C2 isincreased to promote generation of resonance frequencies on alow-frequency side.

In the capacitor component 100 having a structure as described above,the first capacitor unit C1 is provided as a through-type capacitorhaving low ESL to generate resonance frequencies in a high-frequencyside, and the second capacitor unit C2 has high ESL to generateresonance frequencies on a low-frequency side. The second capacitor unitC2 is disposed on the first capacitor unit C1. In this case, the firstcapacitor unit C1 may be disposed to be closer to a mounting substrateas compared to the second capacitor unit C2 to more effectively exhibitlower ESL characteristics.

The capacitor component 100 may be mounted as illustrated in FIG. 5, toobtain a capacitor mounting structure. In the capacitor component 100,the first capacitor unit C1 opposes the mounting substrate 160, and themounting substrate 160 may include three circuit patterns 161 connectedto the first external electrodes 141 and 142 as well as second externalelectrodes 151 and 152 of the capacitor component 100. A solder 162 maybe provided to stably mount the capacitor component 100. The capacitorcomponent 100 may be disposed in a horizontal mounting method, that is,with the first internal electrodes 121 and 122 as well as secondinternal electrodes 123 and 124 parallel to a mounting surface. In amanner similar to the capacitor mounting structure in FIG. 5, the firstcapacitor unit C1 with low ESL can be disposed to be closer to themounting substrate 160 as compared to the second capacitor unit C2 tofurther improve characteristics in a high frequency band of thecapacitor component 100. To mark a mounting direction of the capacitorcomponent 100, a marking unit M may be formed in the body 101 in anexemplary embodiment in FIG. 7 to be described later.

FIG. 6 is a graph illustrating impedance characteristics of a capacitorcomponent obtained according to an exemplary embodiment. As seen in animpedance characteristics graph in FIG. 6, for the capacitor component100 according to an exemplary embodiment, two types of capacitors (afirst capacitor unit and a second capacitor unit) with differentresonance frequencies are included within a single component to maintainimpedance at a low level in a wide frequency band. Thus, the capacitorcomponent 100 described above can be used to reduce the number ofdecoupling capacitors used in a power supply device, a high-speed MPU orthe like, and to effectively reduce mounting costs or space of adecoupling capacitor.

With reference to FIGS. 7 to 9, a modified exemplary embodiment isdescribed. In the modified example of FIG. 7, a marking unit M forindicating a mounting direction of a capacitor component may be formed.A mounting direction may be easily recognized by the marking unit M, andthe first capacitor unit C1 may be disposed to be close to a mountingsubstrate with reference to the mounting direction. The marking unit Mdescribed above may be formed of ceramic, a different material from thatof a different region of the body 101.

FIGS. 8 and 9 are plan views schematically illustrating a form of afirst internal electrode and a second internal electrode included in asecond capacitor unit in a capacitor component according to a modifiedexample. As illustrated in the form illustrated in FIGS. 8 and 9, thenumber of lead out portions included in the first internal electrodes123′ and the second internal electrodes 124′ of the second capacitorunit C2 may be different from an exemplary embodiment as describedpreviously. The first internal electrodes 123′ in the second capacitorunit C2 include lead out portions R5′ and R5 respectively exposed to thefirst surface S1 and the second surface S2 to respectively be connectedto the first external electrodes 141 and 142. The second internalelectrodes 124′ in the second capacitor unit C2 include lead outportions R6′and R6 respectively exposed to a third surface S3 and afourth surface S4 to respectively be connected to the second externalelectrodes 151 and 152. In a modified example, the number of lead outportions of the first internal electrodes 123′and the second internalelectrodes 124′ in the second capacitor unit C2 may be increased toreduce overall equivalent series resistance ESR of a capacitorcomponent.

As set forth above, according to an exemplary embodiment, an impedancereduced capacitor component for effectively removing noise from a widefrequency band may be obtained.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A capacitor component comprising: a bodyincluding a plurality of dielectric layers, a plurality of firstinternal electrodes, and a plurality of second internal electrodes, withthe first and second internal electrodes alternately stacked withdielectric layers interposed therebetween; a first external electrode,on a first surface of the body and on a second surface on an opposingside of the body, connected to one or more of the plurality of firstinternal electrodes; and a second external electrode, on a third surfaceof the body and a fourth surface on an opposing side of the body,connected to one or more of the plurality of second internal electrodes,wherein the capacitor component is divided into a plurality of capacitorunits, each of the plurality of capacitor units including a portion ofthe plurality of first internal electrodes and a portion of theplurality of second internal electrodes, the plurality of capacitorunits including at least a first capacitor unit and a second capacitorunit, wherein the first capacitor unit is a through-type capacitor inwhich one or more of the plurality of first internal electrodes includedtherein is connected to the first external electrode by lead outportions respectively exposed to the first surface and the secondsurface, and wherein, a lead out portion exposed to the second surfaceof the body of one or more of the plurality of first internal electrodesincluded in the first capacitor unit has a width greater than that of alead out portion exposed to the second surface of the body of one ormore of the plurality of first internal electrodes included in thesecond capacitor unit.
 2. The capacitor component of claim 1, wherein atleast a portion of the plurality of capacitor units generates differentresonance frequencies from those of a remaining portion thereof.
 3. Thecapacitor component of claim 1, wherein one or more of the plurality offirst internal electrodes included in the second capacitor unit isconnected to the first external electrode by a lead out portion exposedto at least one of the first surface and the second surface.
 4. Thecapacitor component of claim 1, wherein a lead out portion of one ormore of the plurality of first internal electrodes included in thesecond capacitor unit is disposed in a position to one side of acenterline of the first internal electrode.
 5. The capacitor componentof claim 4, wherein a lead out portion of one or more of the pluralityof second internal electrodes included in the second capacitor unit isdisposed in a position to one side of a center line of the secondinternal electrode.
 6. The capacitor component of claim 5, wherein alead out portion of one or more of the plurality of second internalelectrodes included in the second capacitor unit is disposed in aposition to one side of a center line of the second internal electrodein a direction away from a lead out portion of one or more of theplurality of first internal electrodes included in the second capacitorunit.
 7. The capacitor component of claim 1, wherein one or more of theplurality of second internal electrodes included in the first capacitorunit is connected to the second external electrode through lead outportions respectively exposed to the third surface and the fourthsurface.
 8. The capacitor component of claim 7, wherein one or more ofthe plurality of second internal electrodes included in the secondcapacitor unit is connected to the second external electrode through oneor more lead out portions exposed to at least one of the third surfaceand the fourth surface.
 9. The capacitor component of claim 8, wherein alead out portion exposed to the fourth surface of the body of one ormore of the plurality of second internal electrodes included in thefirst capacitor unit has a width greater than that of a lead out portionexposed to the fourth surface of the body of one or more of theplurality of second internal electrodes included in the second capacitorunit.
 10. The capacitor component of claim 1, wherein the secondcapacitor unit is disposed on the first capacitor unit.
 11. Thecapacitor component of claim 1, wherein the body includes a marking unitindicating a mounting direction of the capacitor component.
 12. Thecapacitor component of claim 11, wherein the marking unit is formed of aceramic and a different material from that of a different region of thebody.
 13. A mounting structure of a capacitor component comprising: acapacitor component including: a body including a plurality ofdielectric layers, a plurality of first internal electrodes, and aplurality of second internal electrodes, with the first and secondinternal electrodes alternately stacked with dielectric layersinterposed therebetween; a first external electrode, on a first surfaceof the body and on a second surface on the opposing side of the body,connected to one or more of the plurality of first internal electrodes,and a second external electrode, on a third surface of the body and on afourth surface on an opposing side of the body, connected to one or moreof the plurality of second internal electrodes, wherein the capacitorcomponent is divided into a plurality of capacitor units, each of theplurality of capacitor units including a portion of the plurality offirst internal electrodes and a portion of the plurality of secondinternal electrodes, the plurality of capacitor units including at leasta first capacitor unit and a second capacitor unit, wherein the firstcapacitor unit is a through-type capacitor in which one or more of thefirst internal electrodes included therein is connected to the firstexternal electrode by lead out portions respectively exposed to thefirst surface and the second surface, wherein, a lead out portionexposed to the second surface of the body of one or more of theplurality of first internal electrodes included in the first capacitorunit has a width greater than that of a lead out portion exposed to thesecond surface of the body of one or more of the plurality of firstinternal electrodes included in the second capacitor unit; and amounting substrate on which the capacitor component is disposed.
 14. Themounting structure of a capacitor component of claim 13, wherein thefirst capacitor unit of the capacitor component opposes the mountingsubstrate.
 15. The mounting structure of a capacitor component of claim13, wherein the mounting substrate includes three circuit patternsconnected to the first external electrode and the second externalelectrode.